by siempre.aprendiendo » Wed Jun 30, 2010 6:36 pm
by siempre.aprendiendo
Wed Jun 30, 2010 6:36 pm
The general specifications are in the "free area" ,
here. For more information you should register. Registration is free, but slow, because are "human-validated". Here are the specifications of the smaller board:
IGEP MODULE FEATURES
• Processor: OMAP3503 or OMAP3530. Applications Processor with ARM Cortex-A8 CPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration
• Memory:
o 128MByte RAM and 256MByte OneNAND flash
o 512MByte RAM and 512MByte OneNAND flash
• On board microSD slot
• On board USB 2.0 OTG miniAB socket for power and data
• On board USB 2.0 Host interface
• Features
o I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.
o Headset, Microphone, backup battery
o USB 2.0 OTG signals, USB HS Host
• Wireless
o Wifi 802.11 b/g
o Bluetooth 2.0
• Connections
o 2 x 70-pin PCB to PCB connector
o 2 x 27-pin flex ribbon connector
• Size: 18 x 68mm
The general specifications are in the "free area" ,
here. For more information you should register. Registration is free, but slow, because are "human-validated". Here are the specifications of the smaller board:
IGEP MODULE FEATURES
• Processor: OMAP3503 or OMAP3530. Applications Processor with ARM Cortex-A8 CPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration
• Memory:
o 128MByte RAM and 256MByte OneNAND flash
o 512MByte RAM and 512MByte OneNAND flash
• On board microSD slot
• On board USB 2.0 OTG miniAB socket for power and data
• On board USB 2.0 Host interface
• Features
o I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.
o Headset, Microphone, backup battery
o USB 2.0 OTG signals, USB HS Host
• Wireless
o Wifi 802.11 b/g
o Bluetooth 2.0
• Connections
o 2 x 70-pin PCB to PCB connector
o 2 x 27-pin flex ribbon connector
• Size: 18 x 68mm